Extremely Efficient Trench gate MOSFETs from ShinDengen
Shindengen has developed smaller high current LF package and also TO-263-7 for
on-board-vehicle adopting new higher heat dissipation by, achieving lower Rds(on)
and Lower Qg(Pf) compared with current products.
You’re interested in? Please contact us.
Nerw Structure Package Adoption
Due to Cu-Clip stucture, Low R(ds)on, small size and Thinner Large Current are achieved.
– AEC-Q101 Qualified
– Tj = 175°C
– LF: 5x6mm (compatible footprint with SOP8)
Are you ready for the future? It would be a pleasure for us to help you – contact us.